Product Description:
The LCB3588 core module is a compact, high-performance solution built on the Rockchip RK3588 platform, measuring just 75mm × 70mm. It interfaces with the baseboard via two 140Pin board-to-board connectors (0.8mm pitch) and four 30Pin FPC connectors (0.5mm pitch), all secured with four M2 screws. This configuration ensures full access to RK3588 pin signals while maintaining high reliability, cost efficiency, and design flexibility. The FPC connectors can be optionally integrated, enhancing durability and stability in industrial applications and vibration-prone environments compared to card-edge or smaller-pitch connectors.
The module incorporates the RK3588 CPU, LPDDR4/LPDDR4X memory with capacities of 2GB, 4GB, 8GB, and 16GB, and high-speed eMMC 5.1 storage in 32GB, 64GB, and 128GB variants. Power management is handled by the RK806 PMU alongside multiple DC-DC and LDO components, with DVFS (Dynamic Voltage and Frequency Scaling) support optimizing power efficiency.
Designed with a modular approach, the LCB3588 exposes all CPU functional pins, ensuring they have been rigorously tested and validated. This architecture streamlines development, shortening project timelines, reducing costs, and enhancing product efficiency.
Key Features:
• Compact and high-performance system-on-module (SoM)
• Pre-installed Android support for seamless deployment
• Energy-efficient design with low power consumption
• Integrated high-speed eMMC storage for enhanced performance
• Wi-Fi and Bluetooth connectivity for wireless applications
• Easily integrates with custom PCB designs
• Flexible and scalable to meet diverse requirements
• Rugged and reliable for industrial applications
• Optimized for rapid product development
Technical Parameters:
| Function | Description |
| CPU | RK3588 8nm; 8-core 64-bit processor architecture (4A76 + 4A55). |
| GPU | ARM Mali-G610 MC4; Supports OpenGL ES 1.1/2.0/3.1/3.2; Vulkan 1.1/1.2;
OpenCL 1.1/1.23/2.0; High-performance 2D image acceleration module. |
| NPU | 6TOPS computing power / 3-core architecture; Supports
int4/int8/int16/FP16/BF16/TF32. |
| VPU | Supports H.265/H.264/AV1/VP9/AVS2 video decoding, up to 8K60FPS;
Supports H.264/H.265 video encoding, up to 8K30FPS. |
| DDR | LPDDR4, with options for 4GB/8GB/16GB. |
| eMMC | eMMC 5.1, with options for 32GB/64GB/128GB. |
| PMU | RK806 |
| OS | Android / Ubuntu / Buildroot / Debian |
| Video Input Interface | MIPI interface :
2 * MIPI(4 lanes) + 4 * MIPI(2 lanes), totally support 6 cameras input;
3 * MIPI(4 lanes) + 2 * MIPI(2 lanes), totally support 5 cameras input;
4 * MIPI(4 lanes) , totally support 4 cameras input;
DVP interface:
8/10/12/16-bit standard DVP interface, up
HDMI RX interface:
HDMI 2.0 2160p@60 Hz, Support HDCP2.3 and HDCP1.4; |
| Video Output Interface | 1 * HDMI2.1 up to 8K@60fps;
1 * HDMI2.0 up to 4K@60fps;
2 * MIPI-DSI up to 4K@60fps;
2 * DP1.4 up to 8K@30fps;
2 * eDP1.3 up to 4K@60Hz;
1 * BT.1120 up to 1080@60fps; |
| Image Signal Processor | 8064*6048@15 dual ISP;
6528*4898@30 dual ISP;
4672*3504@30 single ISP; |
| Video Output Processor | Video Port0 up to 7680*4320@60Hz;
Video Port1 up to 4096*4320@60Hz; |
| Operating temperature | Enterprise Grade: -20°C to 70°C
Industrial Grade: -40°C to 85°C |
| PCB interface | B2B(280 Pin 0.8mm Pitch) + FPC(4 * 30 Pin 0.5mm Pitch) |
| PCB layers | 10 layers |
| PCB size | 75 *70 * 8.2(PCB thickness 1.6mm) |
Support and Services:
The System On Module (SoM) product offers technical support and services to ensure optimal performance and functionality for your embedded system. Our team of experienced engineers provide assistance with hardware and software integration, customization and optimization, and troubleshooting. We also offer testing and validation services to ensure compliance with industry standards and regulations. Our goal is to provide reliable and efficient support to help you achieve your project goals and succeed in your market.
Packing and Shipping:
Product Packaging:
The System On Module (SoM) product is packaged in a secure anti-static bag to prevent any static electricity damage during transportation and storage. The bag is labeled with the product name, model number, and any other relevant information.
Shipping:
The SoM product is shipped in a sturdy cardboard box with foam inserts to ensure that the product is secure and protected during transportation. The box is labeled with the recipient's address, shipping information, and any other necessary details. The package is also sealed with tape to prevent tampering or damage during shipping.
FAQ:
Q: Where is the System On Module SoM manufactured?
A: The System On Module SoM is manufactured in Shanghai, China.
Q: What is the brand name of the System On Module SoM?
A: The brand name of the System On Module SoM is Neardi.
Q: What is the Minimum Order Quantity for the System On Module SoM?
A: The Minimum Order Quantity for the System On Module SoM is 1 piece.
Q: What are the available Payment Terms for the System On Module SoM?
A: The available Payment Terms for the System On Module SoM are L/C, D/A, D/P, and T/T.
Q: What is the Supply Ability of the System On Module SoM?
A: The Supply Ability of the System On Module SoM is 10000 pieces per month.
Q: What is the Delivery Time for the System On Module SoM?
A: The Delivery Time for the System On Module SoM is 7 days.
Q: What are the Packaging Details for the System On Module SoM?
A: The Packaging Details for the System On Module SoM are 33.5×19×9 cm.
Q: Is the price of the System On Module SoM negotiable?
A: Yes, the price of the System On Module SoM is negotiable.
